WCu Tungsten Copper alloy

FOTMA tungsten copper (WCu) alloy delivers near-full density, zero-defect microstructure, and helium-leak-tight integrity (<5×10⁻⁹ Pa·m³/s), rivaling top global competitors. Engineered for extreme thermal conductivity, wear resistance, and structural stability, it is the ultimate solution for high-reliability applications in microelectronics, defense, and industrial tooling.

Alloy Copper Tungsten Breakthrough Material Properties:

1. Unmatched Structural Integrity
   • Density ≥99.5% : Achieved via vacuum sintering and HIP (Hot Isostatic Pressing), eliminating porosity and ensuring superb thermal/electrical conductivity.
   • Ultra-Fine Grain: Average grain size 3–8µm (tested via SEM), enhancing mechanical strength (σb ≥650 MPa) and thermal cycling resistance.
   • Airtight Sealing: Helium leakage rate <5×10⁻⁹ Pa·m³/s – critical for hermetic packaging in aerospace and military systems.
2. Superior Functional Performance
   • Thermal Conductivity (180–220 W/m·K) : Rapid heat dissipation for high-power ICs and LED/LD microelectronic packaging.
   • Low Thermal Expansion (6.5–8.5×10⁻⁶/°C) : Matches semiconductor CTE, minimizing thermal stress in devices.
   • High-Temperature Stability: Maintains dimensional accuracy up to 800°C, ideal for EDM electrodes and welding tools.

Key Applications & FOTMA Solutions

Customization Capabilities

• Composition Flexibility: Adjust W/Cu ratios (50/50 to 90/10) for optimal conductivity vs. hardness.
• Complex Geometries: CNC-machined heatsinks, micro-channel cold plates, or thread-cooled electrodes.
• Surface Treatments: Optional Ni/Ag plating for oxidation resistance or laser texturing for enhanced heat transfer.

Quality Assurance
✅ Material Purity: W powder ≤0.5µm (99.99% purity), Cu-ETP grade.
✅ Defect-Free Guarantee: 100% X-ray inspection pre- and post-sintering.
✅ Global Compliance: RoHS, REACH, ITAR (for defense orders).

Why Choose FOTMA Copper Tungsten Material Heat Sink?
Replace Imports: Performance parity with global brands (Plansee, Sumitomo) at 20–30% lower cost.
Rapid Prototyping: Custom samples delivered in 10 days (standard sizes) via our in-house HIP facility.
Lifecycle Support: From thermal simulation to post-machining – FOTMA engineers ensure seamless integration.

FOTMA WCu Alloy – Where Precision Engineering Meets Unyielding Reliability.