Tungsten Sputtering Target

In the precise world of nano scale thin film technology, every atom is crucial. Choosing a high-performance tungsten sputtering target material is the key to ensuring film quality and improving product performance. With the ultimate pursuit of quality, we select high-purity tungsten raw materials and use advanced production processes to provide you with excellent solutions for your thin film preparation. If you are looking for high-purity, high-performance tungsten targets that can be customized to meet your needs, you have found the ideal partner.

Quality comes from purity: selected high-quality tungsten raw materials

Superior performance starts with a superior starting point. Superior performance starts with a superior starting point. Our tungsten sputtering targets are selected from high-quality tungsten ores and undergo rigorous screening and purification to ensure that the raw material is of the highest purity. We know that impurities are the “invisible killer” of thin film technology, so we strictly control the raw materials and provide high-purity tungsten targets with purity as high as 99.95%, 99.99% or even higher, to minimize the content of impurities in thin films and improve the density, uniformity and various performance indexes of thin films.

High quality tungsten raw materials endow our tungsten sputtering targets with a series of outstanding performance advantages:

Ultra-high sputtering rate: Optimized grain structure and densities ensure higher sputtering rates during the sputtering process, which improves production efficiency and shortens production cycle time.

Excellent film uniformity: Precise processing and uniform composition distribution ensure that the sputtered film has excellent thickness uniformity and composition consistency, which meets the stringent film quality requirements of high-end applications.

High Density and Flatness: Our tungsten targets have extremely high density and excellent mechanical properties, enabling the sputtering of dense, smooth, and strongly adherent films that enhance the performance and reliability of the final product.

Longer service life: High purity tungsten and optimized micro structure give the target a longer service life, reducing the frequency of replacement and effectively saving production costs.

Stable Discharge Characteristics: Excellent electrical and thermal conductivity ensures arc stabilization during sputtering, reduces abnormal discharges, and improves production stability.

Extremely Low Particle Generation: We strictly control impurities and defects in the production process to minimize the generation of particles in the sputtering process and improve the cleanliness of the film, especially for semiconductors and precision optics, which require extremely high cleanliness.

Our customization capabilities include but are not limited to:

Diversified shapes and sizes: circular targets, square targets, annular targets, tube targets, and other shapes, as well as various size specifications, to meet the needs of different sputtering equipment.

Adjustable purity: Provide tungsten targets of different purities, including high-purity tungsten and ultra high purity tungsten, according to your application needs.

Fine grained grain size control: Through special process control, precise control of grain size is achieved to optimize sputtering performance.

Multiple binding methods: Provides various binding solutions such as copper back plate binding, direct binding, etc., to ensure a strong bond between the target material and back plate and good heat dissipation performance.

Special doping and alloying: Based on your specific needs, we provide tungsten alloy targets or doped targets to further enhance the specific properties of the film.