Molybdenum Copper Alloy (MoCu) Heat Sink

FOTMA Molybdenum Copper Alloy (MoCu) Heat Sink Alloy: Lightweight, Ultra-Dense, and Precision-Cooling for Electronics & Defense

Lightweight Yet Ultra-Dense, Engineered for Efficient Thermal Dissipation FOTMA molybdenum copper (MoCu) alloy achieves near-100% density, nanocrystal line structure (grain size ≤5μm) , and exceptional leak-tightness (helium leak rate <5×10⁻⁹ Pa·m³/s), surpassing traditional thermal management materials. Compared to tungsten-copper (WCu), MoCu boasts 30% lower density, superior rollability, and stamping compatibility, making it ideal for mass production of ultra-thin heat sinks.

Breakthrough Advantages of Molybdenum Copper

1. Ultra-Dense Structure & Hermetic Reliability

• Vacuum Hot Pressing + HIP Sintering: Density ≥99.8%, near-zero porosity, and thermal conductivity up to 190–240 W/(m·K) , matching leading global competitors.
• Atomic-Level Sealing: Helium leak rate <5×10⁻⁹ Pa·m³/s, meeting aerospace-grade hermeticity standards to prevent oxidation failure in microelectronics.

2. Lightweight & Cost-Effective Manufacturing

• Density: 9.5–10.5 g/cm³ (vs. WCu ≥14 g/cm³): Reduces component weight for 5G mobile devices, drones, and other weight-sensitive applications.
• Exceptional Rollability: Rolled into ultra-thin foils down to 0.05mm (30% thinner than WCu), ideal for chip-scale vapor chambers.
• High-Precision Stamping: Enables complex-shaped heat sink parts at 40% lower mass-production costs and 50% faster lead times.

3. High-Temperature Stability & Extended Lifespan

• Creep Resistance at 800°C: Maintains >85% strength retention for high-power laser mounts and military radar T/R module cooling.
• Low CTE (6.0–8.5×10⁻⁶/°C): Matches GaN/SiC chips, reducing thermal stress by 70% in power electronics.

Key Applications of Our Copper Moly Material

Why Choose FOTMA MoCu Moly Copper?

✅ Global Alternative: Performance rivals Plansee and H.C. Starck at 60–70% of imported brands’ cost.
✅ Full Customization: Adjust Mo/Cu ratios (50/50 to 85/15), precision etching, microchannel machining, and more.
✅ Military-Grade Quality: 100% X-ray inspection + helium leak testing, compliant with GJB548B and MIL-STD-883 standards.

Rapid Production & Delivery

• 3-day sampling for standard grades, free samples available.
• Rolled foil width ≤600mm, thickness tolerance ±0.002mm.
• Monthly capacity: 20 tons, with 72-hour expedited orders.

FOTMA Moly Copper Alloy – Where Lightweight Meets Uncompromised Thermal Mastery.