High-Silicon Aluminum Alloy

High-Silicon Aluminum Alloy and Aluminum Silicon Carbide (AlSiC) – Advanced Solutions for Electronic Packaging and Thermal Management

High-Silicon Aluminum Alloy: Perfect Balance of Lightweight Design and Thermal Control

Material Characteristics
High-silicon aluminum alloy is a binary alloy composed of silicon (Si) and aluminum (Al). By adjusting silicon content (typically 50%-80%), it combines silicon’s high strength and low thermal expansion with aluminum’s lightweight and high thermal conductivity, making it an advanced material engineered for high-tech industries.

• Lightweight Design: Density of 2.4~2.7 g/cm³, significantly lower than traditional metals like copper or steel, enabling weight reduction in aerospace systems and portable electronics.
• Adjustable Thermal Expansion Coefficient (CTE) : CTE range 7–20 ppm/°C. Increasing silicon content reduces CTE values, ensuring precise compatibility with chips, ceramics, and other critical components.
• Superior Integrated Performance:
  • Thermal conductivity: 100–160 W/m·K for efficient heat dissipation;
  • Specific strength and stiffness surpass magnesium and titanium alloys, with excellent creep resistance;
  • Surface compatibility with gold, silver, copper, and nickel plating, alongside superior weldability and precision machining capabilities.

Applications

• Aerospace: Satellite electronic packaging, thermal control structures, inertial navigation systems;
• High-Performance Electronics: 5G RF module housings, CPU/GPU packaging bases, high-power LED heat sinks;
• Portable Devices: Ultra-thin laptop heat spreaders, drone motor cooling assemblies.

Technical Advantages

• Custom Silicon Content: Tailor alloy ratios to balance CTE and mechanical properties for specific applications;
• Precision Machining: Directly mill, drill, or polish into complex geometries, slashing post-processing costs.

Aluminum Silicon Carbide (AlSiC): A Revolutionary Leap in Strength and Thermal Efficiency

Material Innovation
Aluminum Silicon Carbide (AlSiC) is a ceramic-reinforced aluminum matrix composite. Fabricated via vacuum pressure infiltration, molten aluminum is forced into porous SiC preforms, forming a 3D interpenetrating structure that drastically enhances mechanical and thermal properties.

Core Properties

• Ultra-High Strength and Stiffness:
  • Flexural strength ≥350 MPa, hardness up to HRB 85—2–3x higher than traditional aluminum alloys;
  • Elastic modulus 220–260 GPa, rivaling titanium alloys for exceptional deformation resistance.
• Advanced Thermal Management:
  • Thermal conductivity 160–200 W/m·K, matching pure aluminum for rapid heat dissipation;
  • Tunable CTE range of 6–12 ppm/°C, ideal for GaAs, AlN, and other semiconductor interfaces.
• Extreme Environment Resilience: Resists corrosion, radiation, and temperatures exceeding 300°C, ensuring reliability in harsh conditions.

Applications

• Defense & Aerospace: Missile guidance system housings, spacecraft power modules;
• Power Electronics: IGBT/DBC substrates, EV motor controller cooling plates;
• Optoelectronics: Laser diode heat sinks, fiber-optic device encapsulation.

Process Advantages

• Near-Net-Shape Fabrication: Pre-form SiC skeletons to customer specifications, minimizing machining waste;
• Composition Flexibility: Adjust SiC content between 40%–75% to optimize mechanical and thermal performance.

High-Silicon Aluminum Alloy vs. AlSiC: Choosing the Right Solution

Why Partner with Us?

• Space-Certified Quality: Materials tested under NASA and ESA extreme-condition protocols;
• End-to-End Support: Full-cycle services from design simulation to mass production, with prototypes delivered in 15 days;
• Cost Efficiency: Proprietary AlSiC infiltration technology slashes production costs by 30% versus global competitors.

From satellites to smartphones, High-Silicon Aluminum and AlSiC redefine thermal management through cutting-edge material science.

Contact us today to request a free material selection guide and samples!