Diamond Composite Materials

Diamond Composite Materials: The Ultimate Solution for High-Performance Thermal Management

Revolutionizing Heat Dissipation with Diamond-Metal Composites

By integrating synthetic diamond particles into high-thermal-conductivity metal matrices (Ag, Cu, Al) through advanced composite manufacturing, diamond/metal composites achieve an unprecedented combination of ultra-high thermal conductivity and low thermal expansion, making them the next-generation material for high-power electronic packaging and thermal management.

Diamond-Copper (D/Cu) Composite: The Thermal Performance Benchmark

Material Structure
D/Cu is a matrix composite of synthetic diamond powder and copper alloy. Utilizing premium lab-grown diamonds with intrinsic thermal conductivity of 1,000 W/m·K and near-zero thermal expansion, this material achieves perfect interfacial metallurgical bonding under optimized processing, delivering exceptional thermal and mechanical properties.

Key Advantages

1. Unmatched Thermal Performance:
   • Thermal Conductivity: 500–800 W/m·K (adjustable based on diamond-to-copper ratio);
   • Low CTE: 4–8 ppm/°C, precisely matching semiconductor materials (e.g., Si, GaN, SiC) to minimize thermal stress.
2. Design Flexibility:
   • Adjust diamond content (40%–70%) to balance thermal conductivity and CTE for specific applications.
3. Surface Engineering:
   • Compatible with Ni/Au plating for hermetic sealing, oxidation resistance, and solder ability.
4. Weight Reduction:
   • Density 5.2–6.0 g/cm³, 30% lighter than traditional tungsten-copper (W/Cu) heat sinks.

Diamond-Aluminum (D/Al) Composite: Lightweight Alternative

Material Profile
Similar to D/Cu but with aluminum as the matrix, D/Al offers even greater weight savings while maintaining competitive thermal performance:

• Thermal Conductivity: 400–600 W/m·K;
• CTE: 6–10 ppm/°C;
• Density: 3.0–3.5 g/cm³, 40% lighter than D/Cu, ideal for aerospace and portable electronics.

Why Choose D/Al?

• Optimized for applications where lightweight design is critical without compromising thermal management efficiency.

Dia/Cu vs. Dia/Al: Tailoring Solutions to Your Needs

Applications: Where Diamond Composites Excel

• Power Electronics: IGBT modules, motor controllers, and SiC/GaN device packaging;
• Aerospace & Defense: Radar systems, avionics cooling, hypersonic vehicle thermal shields;
• Optoelectronics: Laser diodes, LED arrays, fiber-optic transceivers;
• Consumer Tech: High-performance CPUs, gaming GPUs, and ultra-thin laptop heat spreaders.

Technical Superiority

• Precision Interface Bonding: Advanced vacuum hot-pressing ensures robust diamond-metal interfaces for minimal thermal resistance;
• Customizable Formulation: Fine-tune diamond size (50–200 μm), volume fraction, and matrix alloys (Cu, Al, Ag) for mission-specific requirements;
• Reliability: Stable performance under extreme conditions (–200°C to +500°C), withstanding thermal cycling and mechanical shock.

Why Our Diamond Composites?

1. Performance Beyond Limits: Highest thermal conductivity among commercial composites;
2. Weight-Saving Innovation: Replace conventional W/Cu or Mo/Cu with 30–50% lighter solutions;
3. End-to-End Support: From material design to prototyping and mass production;
4. Quality Assurance: ISO 9001-certified manufacturing with batch-to-batch consistency.

Elevate your thermal management strategy with diamond composites—where cutting-edge science meets engineering excellence.
📩 Contact us today for samples, datasheets, and custom solutions!