CPC Composite Material

CPC Composite Material: Next-Generation Thermal Management for High-Power Electronics

Origin & Evolution
CPC (Copper-Molybdenum-Copper), a sandwich-structured composite material similar to CMC, was pioneered by Japanese engineers in the early 2000s to address escalating thermal demands in 2G/3G high-power devices. Today, it has emerged as a superior alternative to oxygen-free copper in cutting-edge applications, including Huawei’s 5G base station RF module substrates, where our CPC solutions now dominate the supply chain.

Structural Innovation: Precision-Engineered for Excellence
CPC features a molybdenum-copper alloy core (e.g., Mo70Cu30 or Mo50Cu50) , sandwiched between two oxygen-free copper layers. This hybrid design delivers unmatched performance:

• Molybdenum-Copper Core: Optimized alloy ratios (adjustable per requirements) balance thermal and mechanical properties.
• Oxygen-Free Copper Cladding: Ensures high thermal conductivity (>400 W/m·K, exceeding CMC) and flawless electroplating compatibility.
• Anisotropic CTE Control: Unlike CMC (uniform X-Y expansion), CPC’s CTE in X/Y axes can be independently tuned by adjusting molybdenum particle deformation within the core—a breakthrough enabling precise stress matching.

Key Competitive Advantages

1. Ultra-High Thermal Conductivity
   CPC outperforms CMC with ≥15% higher thermal conductivity (up to 400 W/m·K), making it ideal for heat-intensive applications like 5G mm   Wave chips and high-density power modules.
2. Directional Thermal Expansion Tuning
   Customize X/Y-axis CTE (adjustable range: 6–12×10⁻⁶/K) via core alloy composition and processing, eliminating thermal mismatches in multi-material assemblies.
3. Cost-Effective Stamping Process
   Our proprietary manufacturing technology enables high-precision stamping of CPC into complex shapes (heat pipes, finned sinks, multi-post substrates) while reducing production costs by 30% vs. traditional machining methods. Foreign CPC variants lack this capability.
4. Military-Grade Reliability
   Vacuum hot-pressing ensures interlayer bond strength >120 MPa, validated by 1,500 thermal shock cycles (-65°C to 200°C) without delamination.

Applications: Powering Innovation Across Industries

• 5G/6G Communications: Huawei-certified RF device substrates, phased array antenna cooling plates.
• Advanced Semiconductor Packaging: High-power GPU/CPU heat spreaders, IGBT/DBC substrates.
• New Energy Vehicles: EV motor controllers, onboard charger (OBC) thermal management.
• Aerospace & Defense: Satellite power systems, avionics cooling solutions.

Why Our CPC Stands Out?

• Huawei Trusted Supplier: 100% supply share for 5G base station RF module substrates, with zero defect rate since 2020.
• Rapid Customization: Adjust core ratios (Mo/Cu) and layer thickness within 72 hours.
• Cost Leadership: 20–30% lower lifecycle cost vs. oxygen-free copper, thanks to stamping efficiency and material savings.

The Future of Heat Dissipation Starts Here
As 5G-A and AI drive power densities to unprecedented levels, CPC is rapidly replacing oxygen-free copper in mission-critical thermal interfaces. With our proven expertise and scalable production, we empower clients to conquer thermal bottlenecks while slashing costs.