Widely used in microwave, radio frequency, infrared, laser, integrated circuit and other fields. We also produce IGBT heat dissipation copper needle plates/flat plates, valveable stamping parts, copper stamping parts and aluminum parts. We have strong stamping, forging and machining capabilities. Our products are widely used in power device packaging, 5G base station antennas, IGBT heat sinks and other electronic power fields. The main product series at present include: tungsten copper series; molybdenum copper series; CMC (Cu-Mo-Cu) series; CPC (Cu-MoCu-Cu) series; silicon aluminum, aluminum silicon carbide; diamond-copper/aluminum/silver series; ultra-thin heat pipes, heat spreaders; copper/aluminum pin-type heat dissipation substrates; stamping parts, etching parts, and machined parts made of pure tungsten, pure molybdenum, copper, Invar, Kovar, Kovar-Cu- Kovar, Cu- Invar -Cu, Cu- Fe-Cu and other materials; welding parts such as water-cooling tubes, hot, runners, microchannels, and tube shells; laser bar tungsten copper electrodes with a complete range of brands, high machining accuracy, and high electroplating reliability; bare chips, nickel-plated, gold-plated carriers, and spacers made of various materials such as tungsten copper, molybdenum copper, CPC, CMC, oxygen-free copper, and valves.