CMC Composite Material

CMC Composite Material: The Ultimate Thermal Solution Born from Aerospace Innovation

CMC (Copper-Molybdenum-Copper) composite material is a groundbreaking innovation developed in the 1990s by the United States to address thermal management challenges in the F-22 fighter jet’s power components. This unique “sandwich” structure combines a molybdenum core with oxygen-free copper layers, resolving critical issues of heat dissipation and thermal stress mismatch. Today, it has become a vital material in aerospace, high-end electronics, semiconductors, and beyond.

Structural Design: Precision Layering, Performance Excellence
CMC’s molybdenum core + dual oxygen-free copper cladding sandwich design achieves optimal thermal and mechanical balance:

• Molybdenum Layer: Low thermal expansion coefficient (CTE: 6.5×10⁻⁶/K), ensuring compatibility with ceramics, chips, and other components to prevent thermal stress-induced failure.
• Copper Layer: Exceptional thermal conductivity (≥380 W/m·K), rapidly dissipating heat to maintain device stability.
• Fully Dense Oxygen-Free Copper Cladding: Eliminates air permeability risks, prevents oxidation/delamination, and provides an ideal surface for electroplating, streamlining downstream processing.

Core Advantages

1. Customizable Thermal Expansion Coefficient
   By adjusting the molybdenum-to-copper thickness ratio, CMC’s CTE can be precisely tuned between 6.5×10⁻⁶/K and 9.5×10⁻⁶/K, ensuring seamless compatibility with diverse substrates while balancing thermal efficiency and structural integrity.
2. Unmatched Process ability

• Advanced Stamping Capability: Domestic CMC supports precision stamping of complex flat components, including multi-protrusion heat pipes, reducing production costs and enabling flexible design.
• Global Benchmark: Unlike foreign CMC (limited to machining), China’s CMC boasts superior ductility, tear resistance, and manufacturing adaptability.

1. Military-Grade Reliability
   Vacuum diffusion bonding ensures interlayer bond strength >100 MPa. Passes 1,000 thermal cycles (-58°F to 572°F) with zero delamination, meeting stringent aerospace and defense standards.

Applications

• High-Power Electronics: 5G base station RF modules, IGBT substrates, laser diode heat sinks.
• Aerospace: Avionics thermal plates, satellite power systems.
• EV/New Energy: Motor controllers, onboard charging modules.
• Advanced Manufacturing: Semiconductor packaging, precision instrument heat spreaders.

Why Choose Domestic CMC?

• Localized Production: Full supply chain autonomy, breaking foreign monopolies.
• Cost Efficiency: Stamping reduces material waste, lowering costs by 40% vs. imported alternatives.
• Rapid Customization: Non-standard layer ratios supported, samples delivered in 2 weeks.

Precision Thermal Management, Unrestricted Innovation – CMC Redefines Thermal Limits
Contact us for a free thermal simulation analysis and technical whitepaper!